| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate |
2003-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e87c5d9cf2871dd97e10d1998b9e31aa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7e933bb4657cb10fe4111b816e229d0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0897a7dfd33184205cf54969c6f8bc07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec77a6c08dc09e70c905224169fe3c91
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06fa786214dc7c4520b67a8be765723c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f181dc31298ec8d21d45cb27212c798b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_709038b8bb2d97bf6a5b66771e6eb6b3 |
| publicationDate |
2004-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1420035-A1 |
| titleOfInvention |
Filled epoxy resin composition for semiconductor encapsulation and semiconductor using same |
| abstract |
An epoxy resin composition for semiconductornencapsulation capable of giving semiconductor devices ofnhigh reliability that do not cause short circuits even innpitch reduction in the interconnection electrode distancenor the conductor wire distance therein as well as ansemiconductor device using the same. The epoxy resinncomposition for semiconductor encapsulation, whichncomprises the following components (A) to (C): (A) an epoxynresin, (B) a phenolic resin, and (C) an inorganic fillernfor preventing semiconductors from short-circuiting in anstep of semiconductor encapsulation. |
| priorityDate |
2002-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |