| abstract |
Disclosed is a wafer-holding ring adapted fornholding a wafer on a chemical mechanical polishingnapparatus, which can prevent damage to a wafer,npossesses excellent abrasion resistance, and can reducenreplacement work and consequently can realize massnproduction of polished wafers. In the wafer-holding ringnfor a chemical mechanical polishing apparatus, thensurface of the wafer-holding ring at least in itsnportion, which can come into contact with a wafer, isnformed of a resin composition comprising not less thann30% by weight of polybenzimidazole. |