| abstract |
A resin composition which is excellent in photosensitivelynand developability, gives a cured article excellent innflexibility, soldering heat resistance, resistance to thermalndeterioration, and resistance to electroless gold plating, andnis suitable especially for use in forming solder resists andninterlayer dielectrics. Theresincompositionischaracterizednby containing an oligomer (A) obtained by reacting the followingningredients (a) to (d) : an epoxy resin having at least two epoxyngroups per molecule, a compound having two hydroxy groups andnone carboxy group per molecule, a carboxy group per molecule,na carboxylated rubbery polymer, and a monobasic acid having annunsatuated group. |