| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c0f8dc752059a228fada0efdcc2901b9 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-06 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2002-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e901bda047690e89b21f00b34e335ad
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df3fc3e1cb3fad4b2599abcb1a92e873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf6095af413a1fa68268318c09ac90b3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d82ea90a4948573e0d69df8490156257 |
| publicationDate |
2004-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1408083-A1 |
| titleOfInvention |
Curable epoxy resin composition |
| abstract |
Disclosed is a curable epoxy resin composition comprising at least:n(A) a crystalline epoxy resin, (B) a phenol resin, and (C) a siliconenresin composed of epoxy-containing organic groups and phenyl groups thatndefine an average unit formula of this component. Component (C) is usednin an amount of 0.1 to 500 parts by weight for 100 parts by weight of thensum of weights of components (A) and (B). The composition of theninvention is suitable for transfer and injection molding and may find usenas a curable epoxy resin composition for sealing parts of electrical andnelectronic devices. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014042944-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014042944-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9273225-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104755568-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009041333-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104755568-B |
| priorityDate |
2001-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |