| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_460c960cd09203c2f1727bc268569e14 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-4063
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-04 |
| filingDate |
2002-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_80fd1421f86e5565c4d920d81cd59f46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e65d4df000504b976c16c0f2b84b3651 |
| publicationDate |
2004-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1404734-A1 |
| titleOfInvention |
Reactive hot melt adhesive |
| abstract |
A reactive hot melt adhesive that may be used to reduce or eliminate bondline failure in article of manufacture that contain residual stress prior to cure of the adhesive. |
| priorityDate |
2001-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |