| abstract |
A composition for forming a dielectric substance, characterized in that it comprises (A) composite particles for a dielectric substance comprising inorganic particles having a permittivity of 30 or more and an electroconductive metal or its compound, an electroconductive organic compound or an electroconductive inorganic substance which covers a part or the whole of the surface of the above inorganic particles, and (B) a resin component comprising at least one of a polymerizable compound and a polymer; or in that it comprises ultramicroparticulate composite resin particles comprising (J) inorganic ultramicroparticles having an average particle diameter of 0.1 νm or less and (B) a resin component comprising at least one of a polymerizable compound and a polymer, wherein a part or the whole of the surface of the above inorganic ultramicroparticles (J) is covered by the above resin component (B) and the above inorganic ultramicroparticles (J) is contained in an amount of 20 wt % or more, and inorganic particles having an average particle diameter of 0.1 νm or less and having a permittivity of 30 or more, or inorganic composite particles comprising these inorganic particles and, adhered to a part or the whole of the surface thereof, an electroconductive metal or its compound, an electroconductive organic compound or an electroconductive inorganic substance. |