http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1385915-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dfcd1a217ba95dc487e1e6ee172da349 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09C1-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate | 2002-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd936f9a6703ace36e1b6aa2e0c583b5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb63fc974e145db7a7c79f26bfd2db6e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b0da540324b6ec458ae97f50b1a60025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5492945aa085041e9469cb14294f90a7 |
| publicationDate | 2004-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-1385915-A1 |
| titleOfInvention | Polishing composition having a surfactant |
| abstract | A polishing composition for polishing a semiconductor substrate comprises an aqueous composition having a pH under 5,0, (a) a carboxylic acid polymer comprising polymerized unsaturated carboxylic acid monomers having a number average molecular weight of about 20,000 to 1,500,000, (b) 1 to 15 % by weight of an oxidizing agent, (c) 50-5,000 ppm (parts per million) of a corrosion inhibitor, (d) up to 3.0 % by weight of a complexing agent, and (e) 0.1 to 5.0 % by weight of a surfactant. This invention is directed to a polishing composition used for the chemical mechanical polishing of semiconductor wafers having a copper metal circuit. The composition has a pH of under 5.0 and comprises (a) a carboxylic acid polymer comprising polymerized unsaturated carboxylic acid monomers having a number average molecular weight of about 20,000 to 1,500,000 or blends of high and low number average molecular weight polymer of polymerized unsaturated carboxylic acid monomers, (b) 1to 15 % by weight of an oxidizing agent, (c) up to 3.0 % by weight of abrasive particles, (d) 50-5,000 ppm (parts per million) of an inhibitor, (e) up to 3.0 % by weight of a complexing agent, such as, malic acid, and (f) 0.1 to 5.0 % by weight of an alkali organic sulfonate surfactant. |
| priorityDate | 2001-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 129.