| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6553f9a86c9fe3170954b2f33826289a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4629
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15174
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15787
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-252
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49883
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate |
2003-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f5cd12e73d9744b0ba62173a75c7e70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37183c37a945d65b394364ec9b336bee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e4825c82dd38ff1b3224b42400ef9f88 |
| publicationDate |
2004-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1383362-A2 |
| titleOfInvention |
Copper paste and wiring board using the same |
| abstract |
A wiring board obtained by filling a copper pastenin a via hole formed on a ceramic green sheet and firing itnto form an insulating layer and a via conductor (3), the coppernpaste comprising a copper powder (5), an organic vehicle and atnleast one (7) selected from the group consisting of: a ceramicnparticle having an average particle size of 100 nm or less;nand an Fe 2 O 3 particle, wherein the copper paste comprisesnfrom 6 to 20 parts by mass of the organic vehicle per 100nparts by mass of the copper powder. |
| priorityDate |
2002-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |