http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1383361-A2

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filingDate 2003-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f29a984781808f5e14c56848800ad54
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publicationDate 2004-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-1383361-A2
titleOfInvention Copper paste, wiring board using the same, and production method of wiring board
abstract A wiring board obtained by coating a copper paste on anceramic green sheet and firing it to form a conductor layer (3)nand an insulating layer (1,2), the copper paste comprising ancopper powder, an organic vehicle and at least one (5) selectednfrom the group consisting of: an SiO 2 particle having annaverage particle size of 50 nm or less; and a ceramicnparticle having an average particle size of 100 nm or lessnand non-vitrifiable after sintering.
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