| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d648658dd620f548c24de39659a5e9e3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31739
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31725
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31721
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31786
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31855
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31931
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-924
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31507
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31504
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31971
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31942
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31551
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31938
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31935 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D65-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-08 |
| filingDate |
2002-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2006-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50608bf26784966016cc2284e913131e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b6037467498f6f8b662c12b9e52479c |
| publicationDate |
2006-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1377445-B1 |
| titleOfInvention |
Multilayered packaging materials for electrostatic applications |
| abstract |
A multi-layer structure comprises at least one electrostatic dissipative outer layer and a conductive core layer. The outer layer comprises a material selected from the group consisting of an inherently dissipative polymer, an inherently dissipative polymer blended with a non-conductive matrix polymer, an inherently conductive polymer blended with a non-conductive matrix polymer in an amount sufficient to impart a surface resistivity of greater than 105 and less than 1012 ohms/square, and mixtures thereof. The core layer comprises a material selected from the group consisting of an inherently conductive polymer, an inherently conductive polymer blended with a non-conductive matrix polymer, a conductive filler blended with a non-conductive matrix polymer, and mixtures thereof. The multi-layer structure has unexpected improved electrical properties over prior art structures because the surface resistivity of the outer layer in the multi-layer structure is less than the surface resistivity of the outer layer alone or in another multi-layer structure absent contact with the core layer. |
| priorityDate |
2001-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |