| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36f8253f3d0d59bcd9259217d4385d10 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02282
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-441
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76801 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-30 |
| filingDate |
2003-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74ce767632953a29117a592b955930c8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2cbfe922f4fa2f1a2ed0b0ed1291875
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb51ecc6250cd828e37570304f15e190
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d440c6d380e416edcd676e74b15de362 |
| publicationDate |
2004-01-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1375559-A1 |
| titleOfInvention |
Dielectrics with copper diffusion barrier |
| abstract |
The invention relates to new poly-o-hydroxyamides which are related tonCyclize polybenzoxazoles, which have a high diffusion barrier effectnshow towards metals. The poly-o-hydroxyamidesncan be based on common techniquesnApply semiconductor substrate and simply by heating tonImplement polybenzoxazole. Due to the high blocking effectnDiffusion of metals can affect a diffusion barriernlargely omitted between the conductor track and the dielectricnbecome. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020023666-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7070904-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11768434-B2 |
| priorityDate |
2002-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |