| abstract |
An electromagnetic wave absorbing heat conductivencomposition is used to form an electromagnetic wave absorbingnheat dissipating article that is placed between a heatngenerating electronic component which, when operated,ngenerates heat, reaches a temperature higher than roomntemperature and acts as an electromagnetic wave generatingnsource, and a heat dissipating component. The composition isnnon-fluid at room temperature prior to operation of thenelectronic component, but acquires a low viscosity, softensnor melts under heat generation during operation of thenelectronic component, to fluidize at least a surface of thencomposition so that the composition substantially fills anyngaps between the electronic component and thenheat-dissipating component. |