| abstract |
A semiconductor device (31) having bumps (36) isnto be mounted on a board (33) having pads (34) so thatneach of the bumps (36) is joined to a corresponding onenof the pads (34). Adhesive (39) to be hardened by heatnis provided between the semiconductor device (31) andnthe board (33). The mounting method includes the stepsnof pressing the bumps (36) of the semiconductor devicen(31) on the pads (34) of the board (33), and heating anportion in which each of the bumps (36) and ancorresponding one of the pads (34) are in contact withneach other. A pressure of the bumps (36) to the padsn(34) reaches a predetermined value before a temperaturenof the adhesive (39) to which heat is supplied in thenabove step reaches a temperature at which the adhesiven(39) is hardened. |