| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12528
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-188
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2003-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94c2856037fba0f4515588bf48b631cf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_afee2551a3c7150556fd318894579d56 |
| publicationDate |
2003-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1364979-A1 |
| titleOfInvention |
Thermosetting resin composition and semiconductor device obtained with the same |
| abstract |
A thermosetting resin composition which contains:n (A) an epoxy resin having at least two epoxy groups pernmolecule; (B) a hardener; (C) a compound represented by the following general formulan(1) or (2); and (D) a microcapsule type hardening accelerator containingnmicrocapsules each having a structure made up of a corencontaining a hardening accelerator and a shell covering thencore and containing a polymer having a structural unitnrepresented by the following general formula (3), nand which, when examined by differential scanningncalorimetry at a heating rate of 10°C/min, shows annexothermic peak due to reaction in the range of from 180 ton250°C, and na semiconductor device obtained through sealing with thencomposition are described. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2147942-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2147942-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1411102-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2418079-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6936644-B2 |
| priorityDate |
2002-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |