| abstract |
A solder paste comprising a powder of a Zn-containing Sn-based, lead-freensolder mixed with an activator-containing rosin-based flux to which 0.5 - 10.0 wt% ofnisocyanuric acid or a haloalkyl ester thereof is added can prevent the formation ofnsolder balls and voids during reflow soldering and exhibit good solderability. Ansolder paste comprising a powder of an Ag- or Zn-containing Sn-based, lead-freensolder mixed with an activator-containing rosin-based flux to which 0.01 - 10.0 wt%nof a salicylamide compound also does not exhibit a change in viscosity and exhibitsngood solderability. |