Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f7817b2573160dc2388c37d980f776b6 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B57-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-042 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B57-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
filingDate |
2001-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba9861d504365a8014adc2b350f05715 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6eb210379dd1d470818c9a7f57a93170 |
publicationDate |
2003-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-1339529-A1 |
titleOfInvention |
Methods, apparatus and slurries for chemical mechanical planarization |
abstract |
Methods and apparatus (10) for chemical mechanical planarization of an article (25) such as a semiconductor wafer use polishing slurries including a carbon dioxide solvent or a carbon dioxide-philic composition. A carbon dioxide cleaning solvent step and apparatus may also (10) be employed. |
priorityDate |
2000-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |