http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1331286-A2

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filingDate 2003-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd62ae2ecd95d76e3ef6bac74f287108
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publicationDate 2003-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-1331286-A2
titleOfInvention Method of electroless plating and ceramic capacitor
abstract The invention provides a method of selectively applying an electroless plating to a ceramic body, comprising: selectively applying an organosilicon polymer plating resist to a surface of the ceramic body to form a protected area having the resist, an unprotected area remaining elsewhere; seeding the unprotected area of the ceramic body, the protected area remaining unseeded; activating the unprotected area of the ceramic body with an aqueous solution of a palladium salt, the protected area remaining unaffected; and carrying out selective electroless plating of the unprotected area without removing the plating resist, leaving the protected areas unplated. <??>The invention also relates to a monolithic ceramic planar array (2) of capacitors having connections formed upon interior faces of cavities in the ceramic by the selective electroless plating method. <??>The invention further relates to the use of an organosilicon polymer as a plating resist to protect a ceamic surface against electroless plating. <IMAGE>
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Total number of triples: 36.