http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1331286-A2
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0b6915e6593a92974c626e4394266d36 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1889 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-35 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1605 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-2325 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-35 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-232 |
filingDate | 2003-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd62ae2ecd95d76e3ef6bac74f287108 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c5e81ef003a3ac91d3ef9a54ccf3c39d |
publicationDate | 2003-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | EP-1331286-A2 |
titleOfInvention | Method of electroless plating and ceramic capacitor |
abstract | The invention provides a method of selectively applying an electroless plating to a ceramic body, comprising: selectively applying an organosilicon polymer plating resist to a surface of the ceramic body to form a protected area having the resist, an unprotected area remaining elsewhere; seeding the unprotected area of the ceramic body, the protected area remaining unseeded; activating the unprotected area of the ceramic body with an aqueous solution of a palladium salt, the protected area remaining unaffected; and carrying out selective electroless plating of the unprotected area without removing the plating resist, leaving the protected areas unplated. <??>The invention also relates to a monolithic ceramic planar array (2) of capacitors having connections formed upon interior faces of cavities in the ceramic by the selective electroless plating method. <??>The invention further relates to the use of an organosilicon polymer as a plating resist to protect a ceamic surface against electroless plating. <IMAGE> |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017029477-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11786930-B2 |
priorityDate | 2002-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.