| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0bbf8f83c7d996b3108f95e56b28d21a |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3489 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate |
2001-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2010-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5042142d0b637e57ca95448c76d10830
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8529c5cf00cd3bc48db8339160ff6bc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43e42cebf666180de98f810b808b982a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2e200c5bceb7151c4e484d79d5193e9 |
| publicationDate |
2010-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1330327-B1 |
| titleOfInvention |
Method for applying solder to a substrate or a chip without using flux |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8729215-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8729166-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8575248-B2 |
| priorityDate |
2000-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |