http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1322798-B1
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-42 |
filingDate | 2001-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2004-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb5e9e9d42dc899756c0691bedaaa41c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9210ada95a4d1ae1eb884706d377f3f1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b69dab07366fea7812f931d56ec3a45b |
publicationDate | 2004-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | EP-1322798-B1 |
titleOfInvention | Bath and method of electroless plating of silver on metal surfaces |
abstract | Known methods of improving the solderability of copper surfaces on printed circuit boards present the disadvantage that outer layers of an irregular thickness are formed at the metal surfaces, that these layers are very expensive or that the constituents used in manufacturing them are harmful to the environment. Furthermore, the metal surfaces are to be suited to form bond connections as well as electrical contacts. To overcome these problems there are disclosed a bath and a method of electroless plating of silver by way of charge exchange reaction on surfaces of metals that are less noble than silver, more particularly on copper, that contain at least one silver halide complex and not containing any reducing agent for Ag<+> ions. |
priorityDate | 2000-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.