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filingDate 2002-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30d87373d27de549c658286d1bb71a7c
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publicationDate 2003-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-1320123-A1
titleOfInvention Manufacturing process of an electronic device comprising an inductive micro component
abstract The invention relates to a method for manufacturing electronic components incorporating an inductive micro-component, disposed above a substrate. Such a component comprises: at least one superposition of a layer (10, 10a) of material with low relative permittivity and of a layer of hard mask, the first layer (10) of material with low relative permittivity resting on the upper face substrate (1); a set of metal turns (39) defined above the superposition of layers (10, 10a) of material with low relative permittivity; a layer (35) barrier to the diffusion of copper, present on the lower and lateral faces of metal turns (39). <IMAGE>
priorityDate 2001-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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