| abstract |
A reaction adhesive is provided. The reaction adhesive contains a reactive resin, an encapsulated curing agent for the resin and crystalline monoparticles with ferromagnetic, ferrimagnetic, superparamagnetic, prezoelectric or ferroelectric properties. The reaction adhesive is applied to the substrates and the substrates joined. The adhesive is subjected to an alternating electrical, magnetric or electromagnetic field to release the curing agent. |