| abstract |
In this application is disclosed an adhesive film for anmultilayer printed wiring board which comprises at least thenfollowing Layer A and Layer B in the adjacent position, whereinnthe thermosetting resin composition constituting the Layer Bnis a thermosetting resin composition which contains a resinnhaving a lower softening point than the lamination temperaturenconcerned in an amount of not smaller than 10% by weight, andncan fill with itself (or resin-fill) the through holes and/ornvia holes concurrently with being laminated onto a circuitnboard;n Layer A: A heat-resistant resin layer comprising at leastnone heat-resistant resin selected from the group consisting ofna polyimide, a liquid crystal polymer, an aramid resin and anpolyphenylene sulfide and having a thickness of 2 to 30 µm, Layer B: A thermosetting resin composition layer whichncontains an epoxy resin having at least two epoxy groups in onenmolecule (Component (a)) and an epoxy curing agent (Componentn(b)) and is solid at ordinary temperature, with the use of whichnadhesive film can allows an easy introduction of an insulatingnlayer having excellent mechanical strength at the time ofnproducing a multilayer printed wiring board by a build-upntechnique, and a multilayer printed wiring board havingnexcellent mechanical strength can, in turn, be provided. |