| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d9f3ca41550d315642580237250c5b0 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K71-851
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14618
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-841
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-8426
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01D53-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-58 |
| filingDate |
2002-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02689d716f98543275bd3fa9979f7197
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fcd180e35a11293e736be4e770930206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86a100f2caa232ce7fa9d0737631acf4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c4ee6aa33ae078e4b43f7907330199cd |
| publicationDate |
2003-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1296388-A2 |
| titleOfInvention |
Sealing structure for highly moisture sensitive electronic device element and method for fabrication |
| abstract |
A highly moisture-sensitive element and method of making suchnelement includes an encapsulation enclosure encapsulating all of the highlynmoisture-sensitive electronic devices on a substrate and a sealing materialnpositioned between the substrate and the encapsulation enclosure to form a partialnseal (later to be filled) between the substrate and the encapsulation enclosurenaround each highly moisture-sensitive electronic device or around groups ofnhighly moisture-sensitive electronic devices. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112284581-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108076671-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108076671-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112284581-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10370244-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1863093-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10858245-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8317561-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2519747-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1751603-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7994715-B2 |
| priorityDate |
2001-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |