| abstract |
A multilayer printed wiring board (100) which is excellent in reliability because of the short wiring distance of a conductor circuit, high freedom of conductor circuit design, and little possibility of cracks developing in an interlayer resin insulation layer in the vicinity of a via hole, and which comprises conductor circuits (105) and interlayer resin insulation layers (102) sequentially laminated on a substrate (101), conductor circuits sandwiching an interlayer resin insulation layer being connected via a via hole (107), characterized in that via holes in different hierarchies out of all the via holes are formed to be in a stack via structure, and at least one via hole (1072) out of the above via holes in different hierarchies has a land diameter different from those of other via holes (1071, 1073). |