Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-106 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-126 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-122 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-121 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-125 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028 |
filingDate |
2001-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_924cf08d8b277a06afd8da9dc19edbf1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b7336f7001b3f013cf2e9447a528afd0 |
publicationDate |
2003-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-1282010-A1 |
titleOfInvention |
Photosensitive resin composition, photosensitive element comprising the same, method for producing resist pattern, and method for producing printed wiring board |
abstract |
The present invention provides a photosensitive resinncomposition for laser scanning exposure, which satisfiesnthe following formula (1):n -25≦ E 1 -E 0 E 0 × 100 ≦ 25 nwherein E 0 represents an exposure amount in mJ/cm 2 at whichnthe photosensitive resin composition is cured at the 21stnstep of the density 1.00 of a 41-step step tablet having andensity range from 0.00 to 2.00, a density step of 0.05, antablet size of 20 mm × 187 mm and a step size of 3 mm × 12nmm, by irradiation with a full wavelength active light of anhigh pressure mercury lamp and E 1 represents an exposurenamount in mJ/cm 2 at which the photosensitive resinncomposition after being left for 2 hours under 40 W non-ultravioletnwhite lamp is cured at the 21st step of the 41-stepnstep tablet by irradiation with a full wavelengthnactive light from a high pressure mercury lamp. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005109098-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8129092-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1793274-A3 |
priorityDate |
2000-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |