| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-1234 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-617
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
| filingDate |
2001-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb0087596ae26604720d1b48e4295747
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1dace74731d7e6b1fdf78145d1f21cb5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9578f7c909966c1c02895e6e986f3683 |
| publicationDate |
2003-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1276919-A2 |
| titleOfInvention |
Electroplating bath composition and method of using |
| abstract |
The present invention relates to a copper electroplating bath composition and method of using it for microelectronic device fabrication. In particular, the present invention relates to cooper electroplating in the fabrication of interconnect structures in semiconductor devices. By use of the inventive copper eletroplating bath composition, the incidence of voids in the interconnect structures is reduced. |
| priorityDate |
2000-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |