| abstract |
A photocurable and thermosetting resin compositionncomprising (A) a photosensitive prepolymer having a carboxylngroup in combination with at least two ethylenicallynunsaturated double bonds in its molecule, (B) anpolymerization initiator, (C) a diluent, (D) an oxetanencompound having at least two oxetanyl groups in its molecule,nand (E) a curing promotor is developable with an alkalinensolution and can be formulated as a one package preparation.nSuch a photocurable and thermosetting resin composition andna photosensitive dry film prepared by the use thereof arenuseful as various resist materials and electrical insulatingnmaterials, particularly as solder resists for printed circuitnboards, interlaminar insulating materials for build-upnmulti-layer printed circuit boards, and the like. |