Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_21b6d58fd6a2b0b648fbeec9cb6ddc34 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0545 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3485 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R43-0221 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0056 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-363 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-61 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K31-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K31-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R43-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R12-61 |
filingDate |
2002-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2005-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_580b574a3ecb1c52a60a3314eb688147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bcfe48f4c6fdec461c2b3660e08bd7a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f740ffe9fecc20bd9f8de0d05833c04 |
publicationDate |
2005-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-1256408-B1 |
titleOfInvention |
Method of soldering plastic flex circuits boards by diode laser |
priorityDate |
2001-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |