| abstract |
The invention is directed to a method and composition for providing roughened copper surfaces suitable for subsequent multilayer lamination. The adhesion promoting composition consisting essentially of an oxidizer, a pH adjuster, a topography modifier (Fig.1), and a uniformity enhancer (Fig.2). A coating promoter may be used in place of the uniformity enhancer or in addition to the uniformity enhancer. The process may further comprise the step of contacting the uniform roughened copper surface with a post-dip, wherein the post-dip comprises an azole or silane compound or a combination of said azole and said silane. The post-dip may further comprise, alone or in combination, a titanate, zirconate, and an aluminate. |