| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d80f1040809503e54509c871ba828f75 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2000-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7cd31c0b454546080b75818496708b0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8bfb68961c4da6cac0bc66227e7c39c4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74b553ab88a6711d79cf5dc17486c5e5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8147f7b53224c6e394d5087f73f173ba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_901ed661c2939cd1706244f99f56284a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8487cd38d0d0e0dba76fcdc5f8a68fe5 |
| publicationDate |
2002-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1231300-A1 |
| titleOfInvention |
Plating method and device, and plating system |
| abstract |
The object of the present invention is to provide a plating methodncapable of planarization process of high quality in comparison with thenconventional plating method and also provide a plating device and a platingnsystem adopting the plating method of the invention. In the plating method andndevice, an object 10 to be processed and an electrode plate 20 are dipped in ansolution including objective metal ions and a forward current is supplied betweennthe object and the electrode plate to educe a metal on the surface of the object.nAfter forming a plating film on the object excessively, a backward current isnsupplied between the object 10 and the electrode 20 to uniformly remove at leastnpart of superfluous plating film. |
| priorityDate |
1999-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |