| abstract |
An electronic component mounting method fornplacing electronic components successively to componentnplacing positions on a board (12) by component holdingndevices (38a, 39) equipped with a plurality of removablensuction nozzles (34) which is operable to hold thenelectronic components. The method, as an example of itsnvarious manners, includes: in placing the electronicncomponents onto a multiple board composed of a plurality ofnsub-boards, applying a placement step to all the sub-boards,nthe placement step being a step of placing onto the boardnall of electronic components that are holdable by annidentical suction nozzle; and after completion of thenplacement step, changing the suction nozzle to another andnmoving to a next placement step, whereby electronic-componentnmounting for the individual sub-boards is carriednout. In another aspect, component array intervals (M) ofncomponent feed sections or intervals (N) of componentnplacing positions on the board are made coincident withnarray intervals (L) of the component holding devices. |