| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cef1f43aa7ea51e6a592082d9f2a3103 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0353
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09536
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0358
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0769
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1581
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0352
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4857 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 |
| filingDate |
2000-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1484ac900b19829860ba037f51c3c22a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f3403292ae51754a4f689edd06bf1f53 |
| publicationDate |
2008-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1226743-B1 |
| titleOfInvention |
Method of fabricating a laminated printed circuit board |
| abstract |
Method and apparatus of fabricating a core laminate Printed Circuit Board structure with highly planar external surfaces is provided. A pre-formed flat material including a first resinous sub-material and a second carrier sub-material is used to planarize external surfaces. During lamination, uniform pressure is applied to the pre-formed flat sheet which covers the upper surface of the printed circuit. The resinous material of the first sub-material flows to fill the crevices, vias, etc. of the upper surface of the PCB. Moreover, due to the uniform pressure on the pre-formed flat sheet, the resinous first sub-material is planarized. This planarized surface provides a suitable base substrate for a thin film multilayer build-up structure and that provides electrical connections between the thin film top layers and the Printed Circuit Board - style core layers. |
| priorityDate |
1999-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |