http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1226220-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d3082cd39bb800686b9abbb8aa05c80b |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B57-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D11-00 |
| filingDate | 2000-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e3919b9a123a958287b1c494195f5ad http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57499dea4a8015463a78a49f502ecff8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37f0fc7c3231e82fbbee39cf77ae0907 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af4672f7ce34c085427262db520ac7f8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4bdfebb84a160671d83ff51e5d06750d |
| publicationDate | 2007-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-1226220-B1 |
| titleOfInvention | Polishing system and method of its use |
| abstract | The invention provides a system for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) a liquid carrier, (ii) at least one oxidizing agent, (iii) at least one polishing additive that increases the rate at which the system polishes at least one layer of the substrate, wherein the polishing additive is selected from the group consisting of pyrophosphates, condensed phosphates, phosphonic acids and salts thereof, amines, amino alcohols, amides, imines, imino acids, nitriles, nitros, thiols, thioesters, thioethers, carbothiolic acids, carbothionic acids, thiocarboxylic acids, thiosalicylic acids, hydroxylates, carbonylates, carboxylates, and acids thereof, and mixtures thereof, (iv) at least one stopping compound, and (v) a polishing pad and/or an abrasive. The invention also provides a method of polishing a substrate comprising contacting a surface of a substrate with the system and polishing at least a portion of the substrate therewith. Moreover, the invention provides a method for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (a) contacting the first metal layer with the system, and (b) polishing the first metal layer with the system until at least a portion of the first metal layer is removed from the substrate. |
| priorityDate | 1999-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 164.