http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1218178-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c29ab9b81bc00c17188ac5cd36e05aae |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 |
| filingDate | 1999-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc510ca869c028ff72ce73410ba88fe4 |
| publicationDate | 2002-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-1218178-A1 |
| titleOfInvention | An adhesion promoting layer for use with epoxy prepregs |
| abstract | The present invention relates to an adhesion promoting layer which exhibits high temperature stability and high peel strengths when used in a multi-layer structure for a printed circuit board. More specifically, the present invention relates to a multi-layer structure, containing a prepreg layer wherein the prepreg layer is made from an epoxy resin and a non-amine curing agent; and an adhesion promoting layer comprising a nitrogen containing silane compound. The present invention also relates to a multi-layer structure containing a metal foil layer; an epoxy prepreg layer wherein the epoxy prepreg layer is made from an epoxy resin and a non-amine curing agent comprising at least one of an acid, an anhydride, an alkoxyide, a phenoxide, a polymeric thiol and a phenol; and an adhesion promoting layer comprising a nitrogen containing silane compound, wherein the adhesion promoting layer is between the metal foil layer and the epoxy prepreg layer. |
| priorityDate | 1999-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 523.