| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3457
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-113
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2000-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ae4bdb00d5faed162c46f66933d3d1e |
| publicationDate |
2002-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1207730-A1 |
| titleOfInvention |
Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board |
| abstract |
The objective of present invention is to provide annelectroplating solution capable of forming the upper face ofna via-hole and the upper face of a conductor circuit in the samenlayer in approximately the same plane at the time ofnmanufacturing a multilayer printed circuit board. Thenelectroplating solution of the present invention isncharacterized by containing 50 to 300 g/L of copper sulfate,n30 to 200 g/L of sulfuric acid, 25 to 90 mg/L of chlorine ion,nand 1 to 1000 mg/L of an additive comprising at least a levellingnagent and a brightener. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7910836-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2018092-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2018092-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2028915-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7916492-B1 |
| priorityDate |
1999-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |