http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1198851-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_681a3e32628e7a637b7318f0776fe26b |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K10-466 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K10-462 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K10-464 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K71-211 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K10-468 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K71-10 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-49 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-423 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-43 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-786 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-10 |
| filingDate | 2000-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecb287231893d6d82c52fe4edba86d5e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c46855b2b59ac25a48c2a111c3d2cf0 |
| publicationDate | 2002-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-1198851-A1 |
| titleOfInvention | Reactive formation of dielectric layers and protection of organic layers in organic semiconductor device |
| abstract | In one embodiment, a method of manufacturing a semiconductor device comprises the steps of: a) providing an organic semiconductor layer; b) depositing a reactive species on a portion of the organic semiconductor layer; and c) reacting the reactive species with the portion of the organic layer to form a dielectric layer. In another embodiment, a method of manufacturing a semiconductor device comprises the steps of: a) providing an organic semiconductor layer; and b) exposing a surface of the organic semiconductor layer to a radiation to form a dielectric layer. In another embodiment, a method of manufacturing a transistor comprises the steps of: a) providing an organic semiconductor layer adjacent a gate electrode; b) providing an electrochemical cell wherein the gate electrode is an electrode of the electrochemical cell; and c) applying a voltage to the gate electrode to cause an electrochemical reaction to form a gate dielectric between the gate electrode and the organic semiconductor layer. In one embodiment, a method of protecting organic layers in an electronic device, comprises the steps of: a) providing a first organic layer; b) providing a barrier layer adjacent to the first organic layer, wherein the barrier layer is resistant to a solvent; and c) providing a solution or a dispersion comprising the solvent and a layer-forming material adjacent to the first organic layer. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7297621-B2 |
| priorityDate | 1999-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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