| abstract |
A heat radiation electrode (15) is exposed from the backnsurface of an insulating resin (13), and a metal plate (23) isnaffixed to this heat radiation electrode (15). The back surfacenof this metal plate (23) and the back surface of a flexible sheetnbecome substantially within a same plane, so that it is readilynaffixed to a second supporting member (24). In addition, thentop surface of the heat radiation electrode (15) is madenprotrusive beyond the top surfaces of the pads (14) to reducenthe distance between the semiconductor chip (16) and the heatnradiation electrode (15). Accordingly, the heat generated bynthe semiconductor chip can be efficiently dissipated via thenheat radiation electrode (15), the metal plate (23) andthe secondnsupporting member (24). |