| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_52b7634517d46d22a0ab7dba35304dfa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b5ce39512be7bc49babdd3cf89574250 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-98
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10977
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10734
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-07811
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-305
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate |
2000-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2006-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2661960e8fb3f4873b56dcb3d820133
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_70fd9020b5e5b863426382543956d566 |
| publicationDate |
2006-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1195083-B1 |
| titleOfInvention |
Underfilling material for semiconductor package |
| abstract |
An underfilling material for a semiconductor package holding semiconductor elements on a carrier substrate mounted on a circuit board, containing a one-pack type thermosetting urethane composition which preferably comprises a urethane prepolymer having a terminal isocyanate group, which is obtained by reacting a polyol with an excessive amount of a polyisocyanate, and a fine powder-coated curing agent comprising a curing agent which is in a solid state at room temperature and surface active sites of which are covered with a fine powder. This composition can achieve both the low temperature curing properties and the storage stability. |
| priorityDate |
1999-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |