http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1189252-A1

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4ddcb273a108a5d8472b335280098e06
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H85-11
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H85-11
filingDate 2000-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc16c1d1cc1aedf0258c727aa6168775
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_527565a412c59ddbe49e2f7d8bd336e7
publicationDate 2002-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-1189252-A1
titleOfInvention Fuse link, method of manufacturing the same and solder material
abstract Fuse link, in particular for low-voltage high-performance fuses, NH fuses, which has at least one fuse element with a solder substance in a solder depot of a carrier, the solder being formed on the basis of tin and the carrier on the basis of copper. It is envisaged that the solder contains as an active substance a tin alloy with two further constituents, a first constituent which is larger by weight percent but which is smaller by weight percentage than the proportion of the basic substance tin, the melting temperature of the solder and a second component, which is smaller by weight percent, is a substance that does not dissolve in the tin, which causes crystallization nuclei when cooling from the liquid to the solid state, which result in a fine structure and prevent coarsening of the structure under load.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102006040661-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1557476-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101641758-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008116681-A1
priorityDate 2000-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 21.