| abstract |
A heat-resistant engineering-plastic composition that satisfies a soldering-heatnresistance of 260 °C for 10 to 60 secs., that is less costly, that is free of problemsnin injection molding process, and that is excellent in heat-aging resistance.nA heat-resistant molded product made with the heat-resistant engineering-plasticncomposition, such as a connector mounted on printed circuit board. Thenheat-resistant molded product is produced by (a) melt-kneading (a1) an engineeringnplastic either having or introduced an active site for reacting with anspecific functional group and (a2) either an organic compound that has both thensaid specific functional group and a polymerizing functional group in the samenmolecule or polyolefin that has the said specific functional group described inn(a1) to obtain a resin composition, (b) melt-molding the resin composition comprisingnof (a), and (c) irradiating the melt-molded resin composition with ionizingnradiation. |