Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8cf8d77ac0eff1767b22d2fb9445b64d |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48747 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01072 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48465 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48647 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85207 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85375 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85203 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8501 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-78301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01057 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0381 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-7801 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45124 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-78 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32134 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-85 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31111 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-607 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
filingDate |
2000-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd387fa87a4365ad2f4509c7e5f43d48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20c54167f8490c8372a1bba50260b469 |
publicationDate |
2002-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-1186022-A2 |
titleOfInvention |
Method and apparatus for enabling conventional wire bonding to copper-based bond pad features |
abstract |
A method is described comprising removing an oxide from a surface and then commencing application of a passivation layer to the surface within 5 seconds of the oxide removal. The surface may be a copper surface which may further comprise a bonding pad surface. Removing the oxide may further comprise applying a solution comprising citric acid or hydrochloric acid. Applying the passivation layer may further comprise applying a solution comprising a member of the azole family where the azole family member may further comprise BTA. The method may also further comprise completely applying the passivation layer 35 seconds after commencing its application. |
priorityDate |
1999-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |