| abstract |
To provide an electrodeposited copper foil with carrier,nin which electrical connection holes such as through holesn(PTH), interstitial via holes (IVH), and blind via holesn(BVH) can be readily formed. The invention provides annelectrodeposited copper foil with carrier comprising ancarrier foil, an organic adhesive interface layer formed on ansurface of the carrier foil, and an electrodeposited coppernfoil layer deposited on the adhesive interface layer, whereinncopper microparticles are deposited on the surface of thencarrier foil onto which the organic adhesive interface layernand the electrodeposited copper layer are formed. |