| abstract |
This invention relates, particularly, to a platingnmethod and apparatus for a substrate for uses, such as thenfilling of a metal, e.g., copper (Cu), into a fineninterconnection pattern (recesses) formed in a semiconductornsubstrate. The apparatus has a substrate holding portion (36)nfor horizontally holding and rotating a substrate with itsnsurface to be plated facing upward, a seal material (90) forncontacting a peripheral edge portion of the surface, to benplated, of the substrate held by the substrate holding portionn(36), and sealing the peripheral edge portion in a watertightnmanner, a cathode electrode (88) for passing an electricncurrent upon contact with the substrate, a cathode portionn(38) rotating integrally with the substrate holding portionn(36), an electrode arm portion (30) placed above the cathodenportion (38) so as to be movable horizontally and verticallynand having an anode (98) face-down, and plating liquid pouringnmeans for pouring a plating liquid into a space between thensurface, to be plated, of the substrate held by the substratenholding portion (36) and the anode (98) of the electrode armnportion (30) brought close to the surface to be plated. Thus,nplating treatment and treatments incidental thereto can benperformed by a single unit. |