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filingDate 1999-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45ea96626f754b265abca1085674a6e5
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publicationDate 2001-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-1160270-A1
titleOfInvention Non-perfluoro fluororesin molded article having low-temperature heat sealability
abstract An excellent low temperature heat sealing property isnimparted to a surface of a non-perfluoro fluorine-containing resinnmolded article having F/C of not more than 1.8. A non-perfluoronfluorine-containing resin molded article having a surface layer portionnhaving a low temperature heat sealing property on at least a part of thensurface layer thereof; said surface layer portion having a lowntemperature heat-sealing property has a ratio F/C of the number ofnfluorine atoms to the number of carbon atoms of 0.2≦F/C≦0.9 and anratio O/C of the number of oxygen atoms to the number of carbon atomsnof 0.09≦O/C≦0.40, and a remaining portion of the surface layer has anratio F/C of the number of fluorine atoms to the number of carbon atomsnwhich is larger than that of the surface layer portion having a lowntemperature heat-sealing property and is 0.8≦F/C≦1.8.
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priorityDate 1998-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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