| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_069a92549123806a5d654dc036a676e9 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67034
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 |
| filingDate |
2000-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cbf7bda1618575c7e4c9e21aa3e72123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c2bbdb45d7ef5bb19c0a8ddd96a54e7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76773e667ff51ace460322cc8acac1e5 |
| publicationDate |
2001-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1158073-A1 |
| titleOfInvention |
Plating method, wiring forming method and devices therefor |
| abstract |
The present invention relates to a plating methodnfor use in forming a liner for plating in a conductor-embeddingnfine recess that is defined in a surface of ansemiconductor substrate, and an interconnection formingnmethod for use in forming an interconnection using such anliner, and characterized by reducing an organic metalncompound in a nonaqueous solvent to plate a surface of anbase material with metal. The plating method can easily benused similarly to an aqueous electroless plating process andnis capable of forming a defect-free sound metal plated layernon the surface of a substrate which has a fine recess or thenlike for embedding a conductor therein, and theninterconnection forming method is capable of forming annembedded interconnection that comprises a defect-free soundnelectric conductor in a fine recess. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6790737-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10211544-C1 |
| priorityDate |
1999-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |