| abstract |
A resin composition which comprises 100 parts by weight of a synthetic resin and 50 to 1,500 parts by weight of magnesium oxide particles, wherein the magnesium oxide particles satisfy the following requirements (i) to (v): (i) an average secondary particle diameter of 0.1 to 130 mu m, (ii) a BET method specific surface area of 0.1 to 5 m<2>/g, (iii) a total content of an Fe compound and an Mn compound of 0.01 wt% or less in terms of metals, (iv) an Na content of 0.001 wt% or less, and (v) a Cl content of 0.005 wt% or less, and a molded product formed therefrom. Since the resin composition of the present invention has excellent flame retardancy, heat conductivity and water resistance, it is advantageously used as a material for sealing a heat generating electronic member such as a semiconductor. |