| abstract |
When a Cu-electroplating solution containingnconventional additives is employed, a brightener as one ofnthe additives is decomposed and consumed at the anode asnelectrolysis proceeds, to thereby shorten the service life ofna plating solution and affect conditions for depositing anplating layer. The method of the present invention isndirected to burying, with copper deposited throughnelectroplating, depressed portions such as via holes orngrooves of a multilayer printed wiring board or a wafernhaving copper microwiring, and comprises adsorbing thenaqueous solution containing an additive, particularly anbrightener component, onto a plating object in advance andncarrying out electroplating in a copper plating solutionncontaining no brightener. |