| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e415f6f1eeb8706d299ea086326248bf |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
| filingDate |
2001-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_585e8d18329d0374edb0759df55d2f19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bba4d38a08fabffebde2e55d24c16e07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9364218ea54f0906e0588c0a81ee5580
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07d5f51c916ee7062cccfa7107a408db |
| publicationDate |
2004-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1148156-A3 |
| titleOfInvention |
Copper Electroplating |
| abstract |
Disclosed are compositions and methods for providing a planarized metal layer on ansubstrate having small features. The compositions and methods ofthe present invention providencomplete fill of small features with reduced void formation. |
| priorityDate |
2000-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |