| abstract |
A cyanate-epoxy resin composition comprisingn(A) a cyanate type compound containing two or morencyanato groups in one molecule thereof, (B) an epoxynresin, and (C) a curing accelerator, wherein the epoxynresin is derived from a dicyclopentadiene-phenolnpolyaddition product having a dicyclopentadienenskeleton, and the curing accelerator comprises ancombination of a compound having the function tonaccelerate the curing reaction of the above (A) and ancompound having the function to accelerate the curingnreaction of the above (B). This cyanate-epoxy resinncomposition is excellent in glass transitionntemperature, dielectric characteristics, heatnresistance and low susceptibility to water, and can beneffectively used for preparing a prepreg and fornmanufacturing a laminate, a metal foil-laminated platenand a printed wiring board using the prepreg. |