| abstract |
A chip capacitor 20 is provided in a core substrate 30nof a printed circuit board 10. This makes it possible to shortenna distance between an IC chip 90 and the chip capacitor 20 andnto reduce loop inductance. Since the core substrate 30 isnconstituted by providing a first resin substrate 30a, a secondnresin substrate 30b and a third resin substrate 30c in a multilayernmanner, the core substrate 30 can obtain sufficient strength. |